T3E

T3E Specifications

Model	T3E-600	T3E-900	T3E-1200	T3E-1200E	T3E-1350

Family / Variant	? / ?	? / ?	? / ?	? / ?	? / ?

Introduced	November, 1995	November, 1996	November, 1997	August, 1998	2000
Base Price	900,000 USD	500,000 USD	630,000 USD	?	?

Enclosure^[1]	Cabinet	Cabinet	Cabinet	Cabinet	Cabinet

CPU Features
CPU / Clock Speed	21064 (EV5) / 300 MHz	21064A (EV56) / 450 MHz	21064A (EV56) / 600 MHz	21064A (EV56) / 600 MHz	21064A (EV56) / 675 MHz
Number of CPUs	16 to 128^[2] 64 to 2048^[3]	6? to ?^[2] 32 to ?^[3]	6? to 128^[2] 32 to 2048^[3]	6? to 128^[2] 32 to 2048^[3]	40 to 2176^[3]

Cache Size on Chip	8K I-cache 8K D-cache	8K I-cache 8K D-cache	? ?	? ?	? ?
Secondary Cache	96K	96K	?	?	?
B-cache	?	?	?	?	?

In-cabinet Upgrades	System module, memory

Performance
tpmC @ $/tpmC	?	?	?	?	?
SPECint95	?	?	?	?	?
SPECfp95	?	?	?	?	?
Linpack	112.0 GFLOPS^[6]	161.0 GFLOPS^[6]	211.8 GFLOPS^[6]	?	113.9 GFLOPS^[7]
Theoretical peak	76.8 GFLOPS^[2] 1.2 TFLOPS^[3]	1.8 TFLOPS^[3]	2.5 TFLOPS^[3]	>2.4 TFLOPS^[3]	3 TFLOPS^[3]

Memory / Storage
Memory	1 GB to 256 GB^[2] 4 GB to 4 TB^[3]	?^[2] 2 GB to ?^[3]	? to 256 GB^[2] 8 GB to 4 TB^[3]	? to 4 TB^[3]	10 GB to 1 TB^[3]

Internal Disk Bays	?
Internal Disk Storage	?
Total Disk Storage	?

Removable Media Bays	?
Removable Media	?

I/O
Standard I/O	?

I/O Slots	2-128: 2-16^[2] GigaRing™ channels 4-128^[3] GigaRing™ channels	?: ?	?-128: ?^[2] GigaRing™ channels ?-128^[3] GigaRing™ channels	?-128: ?^[2] GigaRing™ channels ?-128^[3] GigaRing™ channels	5-272: 5-272^[3] GigaRing™ interfaces?
Max. I/O Throughput	GigaRing™: 1 GB/s (per channel) 2 to 16^[2] GB/s (aggregated) 4 to 128^[3] GB/s (aggregated)	?: ?	GigaRing™: 500 MB/s (per interface?) ?^[2] GB/s (aggregated) ? to 128^[3] GB/s (aggregated)	GigaRing™: 500 MB/s (per interface?) ?^[2] GB/s (aggregated) ? to 128^[3] GB/s (aggregated)	GigaRing™: 500 MB/s (per interface?) 2.5 to 136 GB/s (aggregated)^[3]

Options
Audio & Video	?

Networking	10 Mb Ethernet, FDDI, ATM

Storage	Fast SCSI, Fast Wide Differential SCSI, RAID, Fibre Channel, HiPPI, ESCON

Availability Features	RAID, redundant processing element, hot-swap processing element, redundant interconnect paths

Operating Systems / Clustering
OS Support	UNICOS/mk

TruCluster	No
OpenVMS Cluster	No
MSCS	No

Hardware Partitioning	?

Environment
	Air-cooled model		Liquid-cooled model
Acoustics (LWAd / LpAm)
Idle	?		?
Operating	?		?

Altitude
Operating	?		?
Non-operating	?		?

Shock (operating)	?		?
Vibration (operating)	?		?

Temperature	16-30 °C (60-86 °F)		16-28 °C (60-83 °F)
Relative Humidity	20-80% (non-condensing)		35-65% (non-condensing)

Power Requirements
Nominal Voltage	200-240 V / 400 V
Frequency Range	50/60 Hz
Max. Nominal Current	?

Power Source	Three phase
Power Supply	?
Power Usage^[4]	?

Physical Characteristics
	Air-cooled model		Liquid-cooled model
Height	183.6 cm (72.3 in)		198.1 cm (78.0 in)
Width^[5]	72.8 cm (28.7 in)		101.6 cm (40.0 in)
Depth	152.4 cm (60.0 in)		209.3 cm (82.4 in)
Weight	?		?

Warranty
	?

^[1] T3E system consists of: One to six (air-cooled model) or eight (liquid-cooled model) mainframe chassis' (MFC) holding: four or more system modules; 4 processing elements (PE) and 8 memory options per system module; system interconnect; I/O controllers; One or more peripheral cabinets. One to two (air-cooled model) or eight (liquid-cooled model) clock modules. ^[2] Air-cooled models. ^[3] Liquid-cooled models. ^[4] "Packaged System" configuration (see SOC); halt in firmware. ^[5] Single mainframe chassis (MFC). ^[6] 256 CPUs. ^[7] 132 CPUs.