T3D

T3D Specifications

Model	SC	MC	MCA

Family / Variant	? / ?	? / ?	? / ?

Introduced	September, 1993	September, 1993	?
Base Price	2,200,000 USD

Enclosure	Cabinet^[1]	Cabinet^[2]	Cabinet^[3]

CPU Features
CPU / Clock Speed	21064 (EV4) / 150 MHz	21064 (EV4) / 150 MHz	21064 (EV4) / 150 MHz
Number of CPUs	32 to 256	32 to 2048	32 to 128

Cache Size on Chip	8K I-cache 8K D-cache	8K I-cache 8K D-cache	8K I-cache 8K D-cache
Secondary Cache	-	-	-
B-cache	?	?	?

In-cabinet Upgrades	System module, memory, I/O module	System module, memory, I/O module	System module, memory, I/O module

Performance
tpmC @ $/tpmC	?	?	?
SPECint92	?	?	?
SPECfp92	?	?	?
Linpack	12.8 GFLOPS^[8]	12.8 GFLOPS^[8]	12.8 GFLOPS^[8]
Theoretical peak	38.4 GFLOPS	307.2 GFLOPS	19.2 GFLOPS

Memory / Storage
Memory	512 MB to 16 GB	512 MB to 128 GB	512 MB to 8 GB

Internal Disk Bays	1	-	-
Internal Disk Storage	256 MB	-	-
Total Disk Storage	?	?	?

Removable Media Bays	-	-	-
Removable Media	-	-	-

I/O
Standard I/O	?

I/O Slots	2 or 4 I/O gateways	2 to 32 I/O gateways^[4]	2 or 4 I/O gateways
Max. I/O Throughput	400 MB/s (per gateway) 1.6 GB/s (aggregated)	400 MB/s (per gateway) 12.8 GB/s (aggregated)	400 MB/s (per gateway) 1.6 GB/s (aggregated)

Options
Audio & Video	?

Networking	Ethernet, FDDI, ATM

Storage	HiPPI

Availability Features	Redundant processing element, optional redundant power system

Operating Systems / Clustering
OS Support	UNICOS Max

TruCluster	No
OpenVMS Cluster	No
MSCS	No

Hardware Partitioning	?

Environment
Acoustics (LWAd / LpAm)
Idle	?
Operating	?

Altitude
Operating	?
Non-operating	?

Shock (operating)	?
Vibration (operating)	?

Temperature	? °C (? °F)
Relative Humidity	? (non-condensing)

Power Requirements
Nominal Voltage	115 V / 210-250 V	115 V / 210-250 V	208 V / 400 V / 480 V
Frequency Range	50/60 Hz	50/60 Hz	50/60 Hz
Max. Nominal Current	?	?	?

Power Source	Single phase	Single phase	Three phase
Power Supply	?	?	?
Power Usage^[5]	?	?	?

Physical Characteristics
Height	192.4 cm (75.7 in)	192.4 cm (75.7 in)	192.4 cm (75.7 in)
Width	109.0 cm (42.9 in)	109.0 cm (42.9 in)	109.0 cm (42.9 in)
Depth	180.0 cm (70.9 in)^[6]	180.0 cm (70.9 in)^[6]	334.1 cm (131.5 in)^[7]
Weight	?	?	?

Warranty
	?

^[1] T3D SC liquid-cooled system consists of one cabinet with: eight or more system modules; 4 processing elements (PE) and 4 memory options per system module; system interconnect; clock module; I/O gateways; host system (Y-MP or C90) including I/O clusters and SSD; ^[2] T3D MC liquid-cooled system consists of one to four cabinets. Each cabinet holds: eight or more system modules; 4 processing elements (PE) and 4 memory options per system module; system interconnect; clock module; I/O gateways; ^[3] T3D MCA air-cooled system consists of one cabinet with: eight or more system modules; 4 processing elements (PE) and 4 memory options per system module; system interconnect; clock module; I/O gateways; ^[4] Only even amount of I/O gateways. ^[5] "Packaged System" configuration (see SOC); halt in firmware. ^[6] Single mainframe chassis (MFC). ^[7] Mainframe chassis (MFC) and cooling unit. ^[8] 128 CPUs.